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Numerical evaluation of warpage in PoP encapsulated semiconductors

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dc.contributor.authorColling-
dc.contributor.authorF.A.-
dc.contributor.authorMoraes-
dc.contributor.authorC.A.M.-
dc.contributor.authorPeter-
dc.contributor.authorC.R.-
dc.contributor.authorRhod-
dc.contributor.authorE.L.-
dc.contributor.authorHasenkamp-
dc.contributor.authorW.-
dc.contributor.authorPark, Donghyun-
dc.contributor.authorD.-H.-
dc.contributor.authorOh, Taesung-
dc.contributor.authorT.S.-
dc.date.available2021-03-17T11:41:36Z-
dc.date.created2021-02-26-
dc.date.issued2015-
dc.identifier.urihttps://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/13845-
dc.titleNumerical evaluation of warpage in PoP encapsulated semiconductors-
dc.typeArticle-
dc.contributor.affiliatedAuthorOh, Taesung-
dc.identifier.doi10.1109/SBMicro.2015.7298127-
dc.identifier.scopusid2-s2.0-84961783332-
dc.identifier.bibliographicCitationSBMicro 2015 - 30th Symposium on Microelectronics Technology and Devices-
dc.relation.isPartOfSBMicro 2015 - 30th Symposium on Microelectronics Technology and Devices-
dc.citation.titleSBMicro 2015 - 30th Symposium on Microelectronics Technology and Devices-
dc.type.rimsART-
dc.type.docTypeConference Paper-
dc.description.journalClass1-
dc.description.journalRegisteredClassscopus-
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