Numerical evaluation of warpage in PoP encapsulated semiconductors
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Colling | - |
dc.contributor.author | F.A. | - |
dc.contributor.author | Moraes | - |
dc.contributor.author | C.A.M. | - |
dc.contributor.author | Peter | - |
dc.contributor.author | C.R. | - |
dc.contributor.author | Rhod | - |
dc.contributor.author | E.L. | - |
dc.contributor.author | Hasenkamp | - |
dc.contributor.author | W. | - |
dc.contributor.author | Park, Donghyun | - |
dc.contributor.author | D.-H. | - |
dc.contributor.author | Oh, Taesung | - |
dc.contributor.author | T.S. | - |
dc.date.available | 2021-03-17T11:41:36Z | - |
dc.date.created | 2021-02-26 | - |
dc.date.issued | 2015 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/13845 | - |
dc.title | Numerical evaluation of warpage in PoP encapsulated semiconductors | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, Taesung | - |
dc.identifier.doi | 10.1109/SBMicro.2015.7298127 | - |
dc.identifier.scopusid | 2-s2.0-84961783332 | - |
dc.identifier.bibliographicCitation | SBMicro 2015 - 30th Symposium on Microelectronics Technology and Devices | - |
dc.relation.isPartOf | SBMicro 2015 - 30th Symposium on Microelectronics Technology and Devices | - |
dc.citation.title | SBMicro 2015 - 30th Symposium on Microelectronics Technology and Devices | - |
dc.type.rims | ART | - |
dc.type.docType | Conference Paper | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scopus | - |
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