Numerical evaluation of warpage in PoP encapsulated semiconductors

Colling; F.A.; Moraes; C.A.M.; Peter; C.R.; Rhod; E.L.; Hasenkamp; W.; Park, Donghyun; D.-H.; Oh, Taesung; T.S.

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Numerical evaluation of warpage in PoP encapsulated semiconductors

Authors: Colling; F.A.; Moraes; C.A.M.; Peter; C.R.; Rhod; E.L.; Hasenkamp; W.; Park, Donghyun; D.-H.; Oh, Taesung; T.S.

Issue Date: 2015

Citation: SBMicro 2015 - 30th Symposium on Microelectronics Technology and Devices

Journal Title: SBMicro 2015 - 30th Symposium on Microelectronics Technology and Devices

URI: https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/13845

DOI: 10.1109/SBMicro.2015.7298127

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Appears in Collections: College of Engineering > Materials Science and Engineering Major > 1. Journal Articles

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