Preparation of Sub-20-mu m Conductive Silver Pattern Using Photosensitive Silver Paste
- Authors
- Kim, Suk-Joon; Lee, Jang Mi; Lee, Won-Jin; Kim, Sungtae; Park, Chan Pil; Park, Byoungnam; In, Insik
- Issue Date
- 5-Dec-2014
- Publisher
- CHEMICAL SOC JAPAN
- Citation
- CHEMISTRY LETTERS, v.43, no.12, pp.1855 - 1857
- Journal Title
- CHEMISTRY LETTERS
- Volume
- 43
- Number
- 12
- Start Page
- 1855
- End Page
- 1857
- URI
- https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/16508
- DOI
- 10.1246/cl.140630
- ISSN
- 0366-7022
- Abstract
- Photosensitive silver paste was formulated by mixing microsized silver powders, polymeric binders, acrylic monomers, and photoinitiators in an organic medium. A conductive silver line pattern with a width of sub-20 gm was successfully prepared through the simple photolithography process on a poly(ethylene terephthalate) film Strong adhesion and high electrical conductivity of up to 2.8 x 10(-4) Omega cm were accomplished in the presence of triethylamine as an activating agent, which enables the facile sintering of silver particles into a conductive silver pattern, which is critical for the construction of touchscreen panels with a narrow bezel width.
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Collections - College of Engineering > Materials Science and Engineering Major > 1. Journal Articles
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