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Surface modification by atmospheric pressure DBDs plasma: Application to electroless Ni plating on ABS plates

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dc.contributor.authorSong, H.-
dc.contributor.authorChoi, J.M.-
dc.contributor.authorKim, T.W.-
dc.date.accessioned2021-11-11T04:43:31Z-
dc.date.available2021-11-11T04:43:31Z-
dc.date.created2021-11-10-
dc.date.issued2013-
dc.identifier.issn1229-7607-
dc.identifier.urihttps://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/17274-
dc.description.abstractAcrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films. © 2013 KIEEME. All rights reserved.-
dc.language영어-
dc.language.isoen-
dc.subjectAcrylonitrile-butadiene-styrene-
dc.subjectAtmospheric plasmas-
dc.subjectBinding characteristics-
dc.subjectChemically modified surfaces-
dc.subjectCross-sectional SEM image-
dc.subjectDielectric barrier discharges-
dc.subjectThe scanning electron microscopes (SEM)-
dc.subjectThermal expansion coefficients-
dc.subjectAdhesion-
dc.subjectAtmospheric pressure-
dc.subjectBond strength (materials)-
dc.subjectButadiene-
dc.subjectContact angle-
dc.subjectDielectric devices-
dc.subjectElectroless plating-
dc.subjectMetallic films-
dc.subjectNickel-
dc.subjectPlasma applications-
dc.subjectPlasmas-
dc.subjectScanning electron microscopy-
dc.subjectStyrene-
dc.subjectSurface treatment-
dc.subjectThermal expansion-
dc.subjectABS resins-
dc.titleSurface modification by atmospheric pressure DBDs plasma: Application to electroless Ni plating on ABS plates-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, T.W.-
dc.identifier.doi10.4313/TEEM.2013.14.3.133-
dc.identifier.scopusid2-s2.0-84879523324-
dc.identifier.bibliographicCitationTransactions on Electrical and Electronic Materials, v.14, no.3, pp.133 - 138-
dc.relation.isPartOfTransactions on Electrical and Electronic Materials-
dc.citation.titleTransactions on Electrical and Electronic Materials-
dc.citation.volume14-
dc.citation.number3-
dc.citation.startPage133-
dc.citation.endPage138-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.identifier.kciidART001776379-
dc.description.journalClass1-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.subject.keywordPlusAcrylonitrile-butadiene-styrene-
dc.subject.keywordPlusAtmospheric plasmas-
dc.subject.keywordPlusBinding characteristics-
dc.subject.keywordPlusChemically modified surfaces-
dc.subject.keywordPlusCross-sectional SEM image-
dc.subject.keywordPlusDielectric barrier discharges-
dc.subject.keywordPlusThe scanning electron microscopes (SEM)-
dc.subject.keywordPlusThermal expansion coefficients-
dc.subject.keywordPlusAdhesion-
dc.subject.keywordPlusAtmospheric pressure-
dc.subject.keywordPlusBond strength (materials)-
dc.subject.keywordPlusButadiene-
dc.subject.keywordPlusContact angle-
dc.subject.keywordPlusDielectric devices-
dc.subject.keywordPlusElectroless plating-
dc.subject.keywordPlusMetallic films-
dc.subject.keywordPlusNickel-
dc.subject.keywordPlusPlasma applications-
dc.subject.keywordPlusPlasmas-
dc.subject.keywordPlusScanning electron microscopy-
dc.subject.keywordPlusStyrene-
dc.subject.keywordPlusSurface treatment-
dc.subject.keywordPlusThermal expansion-
dc.subject.keywordPlusABS resins-
dc.subject.keywordAuthorAcrylonitrile-butadiene-styrene (ABS)-
dc.subject.keywordAuthorAtmospheric plasma-
dc.subject.keywordAuthorDielectric barrier discharge (DBD)-
dc.subject.keywordAuthorElectroless plating-
dc.subject.keywordAuthorSurface modification-
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