Electropolishing and electroless plating of copper and tin to replace CMP and lithographic processes in Cu/Sn bump fabrication
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jung, M.-W. | - |
dc.contributor.author | Kim, S.-H. | - |
dc.contributor.author | Moon, Y.-S. | - |
dc.contributor.author | Lee, S.-E. | - |
dc.contributor.author | Ko, Y.-K. | - |
dc.contributor.author | Lee, J.-H. | - |
dc.date.accessioned | 2021-12-15T04:43:40Z | - |
dc.date.available | 2021-12-15T04:43:40Z | - |
dc.date.created | 2021-12-10 | - |
dc.date.issued | 2011 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/20558 | - |
dc.description.abstract | A serial electrochemical process consist of copper via filling, electropolishing, electroless copper plating and electroless tin plating is presented for the TSV 3D SiP application. Defect-free copper via filling was achieved by controlling current modes and additives. After via filling, electropolishing was performed to planarize over-plated copper. Electropolishing within the potential of mass-transfer region and with the assistance of additives, fine polished surface without thickness disparity was achieved. For bump formation process, electroless copper and tin plating which is a self-aligned process was applied. Consequently, Cu/Sn bump on via patterned wafer was obtain without using the conventional CMP and lithographic processes. © 2011 IEEE. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.title | Electropolishing and electroless plating of copper and tin to replace CMP and lithographic processes in Cu/Sn bump fabrication | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Lee, J.-H. | - |
dc.identifier.doi | 10.1109/ECTC.2011.5898777 | - |
dc.identifier.scopusid | 2-s2.0-79960428608 | - |
dc.identifier.bibliographicCitation | Proceedings - Electronic Components and Technology Conference, pp.1913 - 1916 | - |
dc.relation.isPartOf | Proceedings - Electronic Components and Technology Conference | - |
dc.citation.title | Proceedings - Electronic Components and Technology Conference | - |
dc.citation.startPage | 1913 | - |
dc.citation.endPage | 1916 | - |
dc.type.rims | ART | - |
dc.type.docType | Conference Paper | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scopus | - |
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