Contact Resistance and Thermal Cycling Reliability of the Flip-Chip Joints Processed with Cu-Sn Mushroom Bumps
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lim, Su-Kyum | - |
dc.contributor.author | Choi, Jin-Won | - |
dc.contributor.author | Kim, Young-Ho | - |
dc.contributor.author | Oh, Tae-Sung | - |
dc.date.accessioned | 2022-01-13T06:42:17Z | - |
dc.date.available | 2022-01-13T06:42:17Z | - |
dc.date.created | 2022-01-04 | - |
dc.date.issued | 2008-09 | - |
dc.identifier.issn | 1738-8228 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/22673 | - |
dc.description.abstract | Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44 MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from 30 m Omega/bump to 25 m Omega/bump due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between -40 degrees C and 80 degrees C, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling. | - |
dc.language | 한국어 | - |
dc.language.iso | ko | - |
dc.publisher | KOREAN INST METALS MATERIALS | - |
dc.subject | COG TECHNIQUE | - |
dc.subject | TEMPERATURE | - |
dc.subject | STRENGTH | - |
dc.subject | GLASS | - |
dc.subject | FILM | - |
dc.title | Contact Resistance and Thermal Cycling Reliability of the Flip-Chip Joints Processed with Cu-Sn Mushroom Bumps | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, Tae-Sung | - |
dc.identifier.scopusid | 2-s2.0-54449092063 | - |
dc.identifier.wosid | 000259913800006 | - |
dc.identifier.bibliographicCitation | JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.46, no.9, pp.585 - 592 | - |
dc.relation.isPartOf | JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS | - |
dc.citation.title | JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS | - |
dc.citation.volume | 46 | - |
dc.citation.number | 9 | - |
dc.citation.startPage | 585 | - |
dc.citation.endPage | 592 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.identifier.kciid | ART001284045 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | COG TECHNIQUE | - |
dc.subject.keywordPlus | TEMPERATURE | - |
dc.subject.keywordPlus | STRENGTH | - |
dc.subject.keywordPlus | GLASS | - |
dc.subject.keywordPlus | FILM | - |
dc.subject.keywordAuthor | flip chip | - |
dc.subject.keywordAuthor | chip on glass | - |
dc.subject.keywordAuthor | mushroom bump | - |
dc.subject.keywordAuthor | contact resistance | - |
dc.subject.keywordAuthor | thermal cycling | - |
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