Contact Resistance and Thermal Cycling Reliability of the Flip-Chip Joints Processed with Cu-Sn Mushroom Bumps
- Authors
- Lim, Su-Kyum; Choi, Jin-Won; Kim, Young-Ho; Oh, Tae-Sung
- Issue Date
- Sep-2008
- Publisher
- KOREAN INST METALS MATERIALS
- Keywords
- flip chip; chip on glass; mushroom bump; contact resistance; thermal cycling
- Citation
- JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.46, no.9, pp.585 - 592
- Journal Title
- JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS
- Volume
- 46
- Number
- 9
- Start Page
- 585
- End Page
- 592
- URI
- https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/22673
- ISSN
- 1738-8228
- Abstract
- Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44 MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from 30 m Omega/bump to 25 m Omega/bump due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between -40 degrees C and 80 degrees C, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.
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Collections - College of Engineering > Materials Science and Engineering Major > 1. Journal Articles
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