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Improving resistance to gate bias stress in pentacene TFTs with optimally cured polymer dielectric layers

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dc.contributor.authorHwang, DK-
dc.contributor.authorPark, JH-
dc.contributor.authorLee, J-
dc.contributor.authorChoi, JM-
dc.contributor.authorKim, JH-
dc.contributor.authorKim, E-
dc.contributor.authorIm, S-
dc.date.accessioned2022-02-07T05:43:24Z-
dc.date.available2022-02-07T05:43:24Z-
dc.date.created2022-02-07-
dc.date.issued2006-
dc.identifier.issn0013-4651-
dc.identifier.urihttps://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/24614-
dc.description.abstractWe report on the insulator charging effects of poly-4-vinylphenol (PVP) gate dielectric on the reliabilities of pentacene thin-film transistors (TFTs). Our PVP films were prepared by spin coating and subsequent curing at various temperatures (155, 175, and 200 degrees C). Evaluated using Au/PVP/p(+)-Si structures, the dielectric strength of PVP films cured at 175 degrees C was superior to those of the other PVP films cured at different temperatures. Although the field mobility (similar to 0.13 cm(2)/V s) obtained from a TFT with PVP film cured at 200 S C appeared higher than that (similar to 0.07 cm(2)/V s) from the device with 175 degrees C-cured polymer film, the TFT prepared at 200 degrees S revealed a low on/off current ratio of less than 10(4) due to its high off-state current and a higher sensitivity to gate bias stress. The unreliable behavior is due to the dielectric charging caused by gate electron injection. We thus conclude that there are some optimal PVP-curing conditions to improve the reliability of pentacene TFT. (c) 2005 The Electrochemical Society.-
dc.language영어-
dc.language.isoen-
dc.publisherELECTROCHEMICAL SOC INC-
dc.subjectTHIN-FILM TRANSISTORS-
dc.subjectINTEGRATED-CIRCUITS-
dc.subjectHIGH-MOBILITY-
dc.subjectDRIVEN-
dc.subjectDISPLAYS-
dc.titleImproving resistance to gate bias stress in pentacene TFTs with optimally cured polymer dielectric layers-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, E-
dc.identifier.doi10.1149/1.2126585-
dc.identifier.scopusid2-s2.0-33645505144-
dc.identifier.wosid000234142400061-
dc.identifier.bibliographicCitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.1, pp.G23 - G26-
dc.relation.isPartOfJOURNAL OF THE ELECTROCHEMICAL SOCIETY-
dc.citation.titleJOURNAL OF THE ELECTROCHEMICAL SOCIETY-
dc.citation.volume153-
dc.citation.number1-
dc.citation.startPageG23-
dc.citation.endPageG26-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaElectrochemistry-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryElectrochemistry-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.subject.keywordPlusTHIN-FILM TRANSISTORS-
dc.subject.keywordPlusINTEGRATED-CIRCUITS-
dc.subject.keywordPlusHIGH-MOBILITY-
dc.subject.keywordPlusDRIVEN-
dc.subject.keywordPlusDISPLAYS-
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