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Flip chip process using local heat transfer from induction heating body
- Authors
- Lee, K.-Y.; Lee, Y.-H.; Jung, B.-Y.; Oil, T.-S.; Oh, T.-S.
- Issue Date
- 2006
- Keywords
- Chip-on-glass; Flat panel display; Flip chip; Heat transfer; Induction heating
- Citation
- Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006, pp.778 - 782
- Journal Title
- Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006
- Start Page
- 778
- End Page
- 782
- ISSN
- 0000-0000
- Abstract
- Flip chip process to attach IC chip directly on the glass substrate of flat panel display was studied by using local heat transfer from induction heating body in AC magnetic field. With applying a magnetic field of 230 Oe at 14 kHz temperature of the induction heating body, the 600Mi-thick Cu electroplated film of 5mmx5mm size, reached to 250 ° C within 60 seconds. The temperature of the glass substrate was maintained below 150 °C at a distance larger than 1.5mm from the Cu induction heating body. COG bonding was successfully accomplished with refiow of the Sn-3.5Ag solder bumps by applying a magnetic field of 230 Oe at 14 kHz for 120 seconds to the 600μm-thick Cu induction heating body of 5mm x5mm size. Copyright © 2006 IMAPS.
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