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Electrochemical kinetics study of electroless copper plating for electronics application
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, DG | - |
| dc.contributor.author | Bae, JS | - |
| dc.contributor.author | Lee, JH | - |
| dc.contributor.author | Kim, YD | - |
| dc.contributor.author | Ahn, YM | - |
| dc.date.accessioned | 2022-02-18T07:43:05Z | - |
| dc.date.available | 2022-02-18T07:43:05Z | - |
| dc.date.created | 2022-02-18 | - |
| dc.date.issued | 2004 | - |
| dc.identifier.issn | 0255-5476 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/25837 | - |
| dc.description.abstract | Electroless copper plating was investigated for the electronics applications, such as a metallization for ULSI and MEMS etc. The role of electrolyte composition on the kinetics and mechanism of the electroless copper deposition process was described. Electrochemical techniques were employed for the investigations. The mixed potential and current were determined and then those were compared with experimental deposition rate. The kinetics is strongly influenced by the pretreatment and additive concentrations. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | TRANS TECH PUBLICATIONS LTD | - |
| dc.subject | DEPOSITION | - |
| dc.subject | ULSI | - |
| dc.title | Electrochemical kinetics study of electroless copper plating for electronics application | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Lee, JH | - |
| dc.identifier.doi | 10.4028/www.scientific.net/MSF.449-452.393 | - |
| dc.identifier.scopusid | 2-s2.0-3142681740 | - |
| dc.identifier.wosid | 000189492000095 | - |
| dc.identifier.bibliographicCitation | DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2, v.449-4, pp.393 - 396 | - |
| dc.relation.isPartOf | DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2 | - |
| dc.citation.title | DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2 | - |
| dc.citation.volume | 449-4 | - |
| dc.citation.startPage | 393 | - |
| dc.citation.endPage | 396 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article; Proceedings Paper | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Ceramics | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
| dc.subject.keywordPlus | DEPOSITION | - |
| dc.subject.keywordPlus | ULSI | - |
| dc.subject.keywordAuthor | electroless copper plating | - |
| dc.subject.keywordAuthor | mixed potential | - |
| dc.subject.keywordAuthor | additive | - |
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Related Researcher
- Lee, Jae Ho
- Engineering (Advanced Materials)