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Dissolution of Cu into Sn-based solders during reflow soldering
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, JH | - |
| dc.contributor.author | Shin, DH | - |
| dc.contributor.author | Kim, YS | - |
| dc.date.accessioned | 2022-03-14T07:42:29Z | - |
| dc.date.available | 2022-03-14T07:42:29Z | - |
| dc.date.created | 2022-03-14 | - |
| dc.date.issued | 2003-12 | - |
| dc.identifier.issn | 1598-9623 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/25915 | - |
| dc.description.abstract | Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. Several plausible causes for the excess dissolution of Cu into the solders were explored with experimental observations. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | KOREAN INST METALS MATERIALS | - |
| dc.subject | INTERFACE | - |
| dc.subject | LAYER | - |
| dc.title | Dissolution of Cu into Sn-based solders during reflow soldering | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Kim, YS | - |
| dc.identifier.doi | 10.1007/BF03027258 | - |
| dc.identifier.wosid | 000187457400010 | - |
| dc.identifier.bibliographicCitation | METALS AND MATERIALS INTERNATIONAL, v.9, no.6, pp.577 - 581 | - |
| dc.relation.isPartOf | METALS AND MATERIALS INTERNATIONAL | - |
| dc.citation.title | METALS AND MATERIALS INTERNATIONAL | - |
| dc.citation.volume | 9 | - |
| dc.citation.number | 6 | - |
| dc.citation.startPage | 577 | - |
| dc.citation.endPage | 581 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.description.journalRegisteredClass | kci | - |
| dc.description.journalRegisteredClass | other | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
| dc.subject.keywordPlus | INTERFACE | - |
| dc.subject.keywordPlus | LAYER | - |
| dc.subject.keywordAuthor | reflow soldering | - |
| dc.subject.keywordAuthor | supersaturation | - |
| dc.subject.keywordAuthor | channel | - |
| dc.subject.keywordAuthor | Cu(6)Sn(5) | - |
| dc.subject.keywordAuthor | Sn-37Pb | - |
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