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Dissolution of Cu into Sn-based solders during reflow soldering
- Issue Date
- Dec-2003
- Publisher
- KOREAN INST METALS MATERIALS
- Keywords
- reflow soldering; supersaturation; channel; Cu(6)Sn(5); Sn-37Pb
- Citation
- METALS AND MATERIALS INTERNATIONAL, v.9, no.6, pp.577 - 581
- Journal Title
- METALS AND MATERIALS INTERNATIONAL
- Volume
- 9
- Number
- 6
- Start Page
- 577
- End Page
- 581
- ISSN
- 1598-9623
- Abstract
- Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. Several plausible causes for the excess dissolution of Cu into the solders were explored with experimental observations.
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