Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Shear strength and aging characteristics of 63Sn-37Pb solder bumps with various solder ball and pad sizes
- Issue Date
- Jun-2003
- Publisher
- KOREAN INST METALS MATERIALS
- Keywords
- solder; Sn-Pb; shear strength; aging; electronic packaging
- Citation
- METALS AND MATERIALS INTERNATIONAL, v.9, no.3, pp.273 - 278
- Journal Title
- METALS AND MATERIALS INTERNATIONAL
- Volume
- 9
- Number
- 3
- Start Page
- 273
- End Page
- 278
- ISSN
- 1598-9623
- Abstract
- The shear strength and aging characteristics of 63Sn-37Pb solder bumps were characterized with variation in solder ball and UBM pad sizes. The shear strength increased with shorter effective crack size, a(eff), which was determined with the solder ball and pad sizes. The shear strength of the solder bumps on Au/Ni/Cu and Ni/Cu did not change significantly with reflow time. Substantial decrease in the shear strength occurred for the solder bumps formed on Au/Ni/Cu with aging treatment, and the shear strength after aging was also related to the bump shape which was determined with the solder ball and pad sizes.
- Files in This Item
- There are no files associated with this item.
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.