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플립칩 솔더링의 자기정렬 효과에 관한 모델링Modeling of Self-Aligning Effect in Flip Chip Soldering

Other Titles
Modeling of Self-Aligning Effect in Flip Chip Soldering
Authors
정용진안도현유중돈김용석
Issue Date
2002
Publisher
대한용접접합학회
Citation
대한용접접합학회지, v.20, no.6, pp.65 - 71
Journal Title
대한용접접합학회지
Volume
20
Number
6
Start Page
65
End Page
71
URI
https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/26885
ISSN
2466-2232
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College of Engineering > Materials Science and Engineering Major > 1. Journal Articles

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