Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface
- Authors
- Lee, JH; Park, JH; Shin, DH; Lee, YH; Kim, YS
- Issue Date
- Sep-2001
- Publisher
- SPRINGER
- Keywords
- Au-embrittlement; aging treatment; Au-containing ternary intermetallic; redeposition; fracture energy
- Citation
- JOURNAL OF ELECTRONIC MATERIALS, v.30, no.9, pp.1138 - 1144
- Journal Title
- JOURNAL OF ELECTRONIC MATERIALS
- Volume
- 30
- Number
- 9
- Start Page
- 1138
- End Page
- 1144
- URI
- https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/27186
- DOI
- 10.1007/s11664-001-0141-9
- ISSN
- 0361-5235
- Abstract
- In this study, the effects of the under bump metallurgy (UBM) structure and Cu content in solders on the redeposition rate of Au-containing ternary intermetallics at the solder/UBM interface were investigated. A UBM structure with a Ni diffusion barrier, Au/Ni/Cu, appeared to promote the redeposition of ternary Au-containing intermetallics at the solder/UBM interface of the ternary during the solid-state aging treatment and the Au-embrittlement of the solder interconnections. Copper added to the eutectic Sn-Pb and Sn-Ag solders was observed to be very effective in retarding the redeposition by forming the ternary intermetallics in solder matrices and preventing the Au-embrittlement. These phenomena were discussed with the microstructures observed.
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Collections - College of Engineering > Materials Science and Engineering Major > 1. Journal Articles
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