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Reliability of composite solder bumps produced by an in-situ process
- Issue Date
- Oct-2000
- Publisher
- SPRINGER
- Keywords
- In-situ composite; Cu6Sn5 dispersoid; thermal stability; reaction rate; shear strength
- Citation
- JOURNAL OF ELECTRONIC MATERIALS, v.29, no.10, pp.1264 - 1269
- Journal Title
- JOURNAL OF ELECTRONIC MATERIALS
- Volume
- 29
- Number
- 10
- Start Page
- 1264
- End Page
- 1269
- ISSN
- 0361-5235
- Abstract
- In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Gu,Sn, dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.
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