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Fluxless laser reflow bumping of Sn-Pb eutectic solder
- Issue Date
- 14-Apr-2000
- Publisher
- PERGAMON-ELSEVIER SCIENCE LTD
- Keywords
- bonding; interfaces; laser heating; fluxless soldering
- Citation
- SCRIPTA MATERIALIA, v.42, no.8, pp.789 - 793
- Journal Title
- SCRIPTA MATERIALIA
- Volume
- 42
- Number
- 8
- Start Page
- 789
- End Page
- 793
- ISSN
- 1359-6462
- Files in This Item
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