Effects of mechanical properties of metal films on thf adhesion strength of Cr/polyimide interfaces
- Authors
- Choi, JW; Oh, TS
- Issue Date
- 1997
- Publisher
- MATERIALS RESEARCH SOCIETY
- Citation
- THIN FILMS: STRESSES AND MECHANICAL PROPERTIES VI, v.436, pp.121 - 126
- Journal Title
- THIN FILMS: STRESSES AND MECHANICAL PROPERTIES VI
- Volume
- 436
- Start Page
- 121
- End Page
- 126
- URI
- https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/27674
- ISSN
- 0272-9172
- Abstract
- Effects of mechanical properties of Cu/Cr metal films on the peel strength of Cr/PI interfaces have been studied. Or and Cu thin films were successively sputter-deposited on in-situ RT; plasma-treated polyimides, and 20 mu m-thick Cu was electroplated. With increasing the yield strength of Cu/Cr films from 156 MPa to 325 MPa, peel strength of Cr/FMDA-ODA and Cr/BPDA-PDA were lowered from 75 g/mm to 57 g/mm and from 69 g/mm to 20 g/mm, respectively. With identical Cu/Cr metal films, lower peel strength was obtained on Cr/BPDA-PDA interfaces, compared to the values of Cr/PMDA-ODA. Peel strength was also decreased more pronouncedly on Cr/BPDA-PDA with increasing the yield strength of Cu/Cr metal films. With T/H (80 degrees C/94% R.H.) exposure, however, peel strength was lowered much more pronouncedly on Cr/PMDA-ODA than on Cr/BPDA-PDA, especially for specimens with Cu/Cr metal films of lower yield strength.
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Collections - College of Engineering > Materials Science and Engineering Major > 1. Journal Articles
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