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Activation behavior of SLS and ELC poly-Si after ion shower doping

Authors
Jin, Beop-JongOh, Sung-JaeKim, Deok HoiUemoto, TstomuKim, Chi WooRo, Jae-Sang
Issue Date
2006
Publisher
INST IMAGE INFORMATION & TELEVISION ENGINEERS
Citation
IDW '06: PROCEEDINGS OF THE 13TH INTERNATIONAL DISPLAY WORKSHOPS, VOLS 1-3, pp.769 - +
Journal Title
IDW '06: PROCEEDINGS OF THE 13TH INTERNATIONAL DISPLAY WORKSHOPS, VOLS 1-3
Start Page
769
End Page
+
URI
https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/30009
Abstract
Thermal activation was carried out using SLS poly-Si or ELC poly-Si after B+ ion shower doping. Reverse annealing was found in the temperature ranges between 400 degrees C and 650 degrees C investigated in this study. Grain boundaries seemed to play a critical role for dopant activation in poly-Si at low temperatures. The RTA treated samples were observed to exhibit lower sheet resistance than the FA treated one. The reverse annealing is believed to play an important role for activation efficiency.
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