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Effects of Ultrasonic Process on the Electroless Cu Plating on Non-Conductive Printed Circuit Board Substrate
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kang, Ju-Suk | - |
| dc.contributor.author | Chun, Hong-Wook | - |
| dc.contributor.author | Lee, Jae-Ho | - |
| dc.date.available | 2020-07-10T04:19:16Z | - |
| dc.date.created | 2020-07-06 | - |
| dc.date.issued | 2018-09 | - |
| dc.identifier.issn | 1941-4900 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/3266 | - |
| dc.description.abstract | Electroless Cu plating has been used in PCB industry when circuit is made upon non-conductive substrate. Adhesion is getting important since the size of L/P is reduced. The adhesion of copper on substrate is mainly dependent on Pd activation and copper seeding. In this study, the methods of Pd activation were varied and the effects of ultrasonic process were investigated. The thickness, surface and adhesion of the electroless copper layers were analyzes to investigate the effects of each variable on the adhesion of the Cu layers. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | AMER SCIENTIFIC PUBLISHERS | - |
| dc.subject | DEPOSITION | - |
| dc.subject | NANOPARTICLES | - |
| dc.subject | ACTIVATION | - |
| dc.title | Effects of Ultrasonic Process on the Electroless Cu Plating on Non-Conductive Printed Circuit Board Substrate | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Lee, Jae-Ho | - |
| dc.identifier.doi | 10.1166/nnl.2018.2786 | - |
| dc.identifier.wosid | 000446690600022 | - |
| dc.identifier.bibliographicCitation | NANOSCIENCE AND NANOTECHNOLOGY LETTERS, v.10, no.9, pp.1292 - 1296 | - |
| dc.relation.isPartOf | NANOSCIENCE AND NANOTECHNOLOGY LETTERS | - |
| dc.citation.title | NANOSCIENCE AND NANOTECHNOLOGY LETTERS | - |
| dc.citation.volume | 10 | - |
| dc.citation.number | 9 | - |
| dc.citation.startPage | 1292 | - |
| dc.citation.endPage | 1296 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.subject.keywordPlus | DEPOSITION | - |
| dc.subject.keywordPlus | NANOPARTICLES | - |
| dc.subject.keywordPlus | ACTIVATION | - |
| dc.subject.keywordAuthor | Electroless Cu Plating | - |
| dc.subject.keywordAuthor | Ultrasonic | - |
| dc.subject.keywordAuthor | PCB | - |
| dc.subject.keywordAuthor | Pd Activation | - |
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Related Researcher
- Lee, Jae Ho
- Engineering (Advanced Materials)