Non Destructive Thickness Analysis in Triple Ni/Cr Thin Film Using Electrolytic Etching and Potential Determination Process

Abstract

Ni/Cr plating is one of the most commonly used platings for decorative purposes. Cr is a metal with excellent corrosion resistance. In the case of decorative Cr, plating with a thickness of less than 0.5 mu m is generally performed, so accurate chromium plating thickness analysis method is needed in rack plating. In this study, the etching characteristics of Cr and Ni were analyzed by electrochemical method. The electrode potential was maintained during the etching of specific coating layer and then the etching time directly related with coating thickness. The Ni/Cr plating thickness was analyzed by electrolytic etching method and consequently the Cr thickness distribution of rack plated specimens was determined.