Effects of Complexing Reagent on Electroless Nickel Iron Alloy Plating for the Diffusion Barrier of UBM
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Koo, Ja-Kyung | - |
dc.contributor.author | Lee, Jae-Ho | - |
dc.date.available | 2020-07-10T05:41:08Z | - |
dc.date.created | 2020-07-06 | - |
dc.date.issued | 2017 | - |
dc.identifier.issn | 1345-9678 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/6932 | - |
dc.description.abstract | Electro and electroless nickel platings have been extensively used as a diffusion barrier in under bump metallization (UBM) or as a surface finish on printed circuit boards (PCB). Even though a thin Ni layer on top of Cu can reduce the interfacial reactions with Sn-rich solders at a low re flow temperature, it may not be so effective when a re flow process is performed at a higher temperature and for a longer period. To provide a more robust diffusion barrier layer than electrodes Ni, electroless NiFe alloy system has been proposed. Since the electroless Ni-Fe plating bath has been rarely studied, the proper baths were not available commercially. In this research, the electroless plating of Ni-Fe alloys was investigated on the basis of complexing reagent. The stability of complexing reagent was studied. The compositions of electroplating layers were analyzed with EDS. The desired Ni-Fe alloy were obtained by controlling the chemical composition of the bath and its operating parameters. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | JAPAN INST METALS | - |
dc.subject | SN SOLDER | - |
dc.subject | METALLIZATION | - |
dc.title | Effects of Complexing Reagent on Electroless Nickel Iron Alloy Plating for the Diffusion Barrier of UBM | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Lee, Jae-Ho | - |
dc.identifier.doi | 10.2320/matertrans.MA201606 | - |
dc.identifier.scopusid | 2-s2.0-85011841042 | - |
dc.identifier.wosid | 000397407600005 | - |
dc.identifier.bibliographicCitation | MATERIALS TRANSACTIONS, v.58, no.2, pp.148 - 151 | - |
dc.relation.isPartOf | MATERIALS TRANSACTIONS | - |
dc.citation.title | MATERIALS TRANSACTIONS | - |
dc.citation.volume | 58 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 148 | - |
dc.citation.endPage | 151 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | SN SOLDER | - |
dc.subject.keywordPlus | METALLIZATION | - |
dc.subject.keywordAuthor | electroless | - |
dc.subject.keywordAuthor | nickel iron alloy | - |
dc.subject.keywordAuthor | complexing agent | - |
dc.subject.keywordAuthor | under bump metallization (UBM) | - |
dc.subject.keywordAuthor | stability | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
94, Wausan-ro, Mapo-gu, Seoul, 04066, Korea02-320-1314
COPYRIGHT 2020 HONGIK UNIVERSITY. ALL RIGHTS RESERVED.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.