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Fabrication and characterization of dissolving microneedle arrays for improving skin permeability of cosmetic ingredients

Authors
Park, YonghunKim, Kyu SikChung, MinsubSung, Jong HwanKim, Bumsang
Issue Date
25-Jul-2016
Publisher
ELSEVIER SCIENCE INC
Keywords
Dissolving microneedles; Cosmetic ingredients; Skin permeation; Niacinamide; Ascorbic acid; Laser-writing process
Citation
JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, v.39, pp.121 - 126
Journal Title
JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
Volume
39
Start Page
121
End Page
126
URI
https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/7562
DOI
10.1016/j.jiec.2016.05.022
ISSN
1226-086X
Abstract
Delivery of sufficient amounts of cosmetic ingredients through the skin is a big challenge in the cosmetic industry, since the stratum corneum, the outer layer of the skin, acts as a barrier against external substances. One of the methods to solve this problem is using microneedles. In this study, a laser-writing process is described for fabricating a polydimethylsiloxane mold for microneedles, which is a very simple and efficient method compared to the conventional photolithography technique. Using this polydimethylsiloxane mold, it was possible to fabricate a dissolving sodium hyaluronate microneedle array with consistent shapes and sizes. Amylopectin was used to tailor the properties of the microneedles, such as mechanical strength and solubility. When amylopectin content in the needle increased, the mechanical strength of the needle increased but the dissolution rate of the microneedles decreased. Using the microneedle array, significant enhancement in the skin permeability of niacinamide and the anti-oxidant activity of ascorbic acid after crossing the skin was observed. These results indicate that the microneedle array developed in this study has the potential to be used in cosmetics by being combined with conventional cosmetic patches. (C) 2016 The Korean Society of Industrial and Engineering Chemistry. Published by Elsevier B.V. All rights reserved.
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