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1.3 nm Effective Oxide Thickness Self-aligned InGaAs MOS-HEMT Using SiNx/HfO2 Bi-layer as Gate Insulator

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DC FieldValueLanguage
dc.contributor.author차호영-
dc.date.available2020-07-10T07:03:40Z-
dc.date.created2020-07-08-
dc.date.issued2015-06-29-
dc.identifier.urihttps://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/9708-
dc.language영어-
dc.language.isoen-
dc.publisherAWAD-
dc.title1.3 nm Effective Oxide Thickness Self-aligned InGaAs MOS-HEMT Using SiNx/HfO2 Bi-layer as Gate Insulator-
dc.typeArticle-
dc.contributor.affiliatedAuthor차호영-
dc.identifier.bibliographicCitationAWAD proceeding, v.1, no.1, pp.195 - 197-
dc.relation.isPartOfAWAD proceeding-
dc.citation.titleAWAD proceeding-
dc.citation.volume1-
dc.citation.number1-
dc.citation.startPage195-
dc.citation.endPage197-
dc.type.rimsART-
dc.description.journalClass1-
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