ScholarWorks@Hongik

Journal of Materials Research

Journal Title

  • Journal of Materials Research

ISSN

  • E 2044-5326 | P 0884-2914 | 0884-2914 | 2044-5326

Publisher

  • Materials Research Society

Listed on(Coverage)

JCR1997-2019
SJR1999-2019
CiteScore2011-2019
SCI2010-2019
SCIE2010-2021
CC2016-2021
SCOPUS2017-2020

Active

  • Active

    based on the information

    • SCOPUS:2020-10

Country

  • USA

Aime & Scopes

  • Journal of Materials Research (JMR) publishes the latest advances about the creation of new materials and materials with novel functionalities, fundamental understanding of processes that control the response of materials, and development of materials with significant performance improvements relative to state of the art materials.

Homepage

Article List

1 - 7 out of 7 results.

Hardening by crystallization during superplastic flow in a powder-metallurgy-processed Zr65Al10Ni10Cu15 glass metallic alloy

Jeong, HG; Kim, WJ

ArticleIssue Date2005CitationJOURNAL OF MATERIALS RESEARCH, v.20, no.6, pp.1447 - 1455PublisherCAMBRIDGE UNIV PRESS
Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn-Cu solder and thin film metallization

Ha, JS; Oh, TS; Tu, KN

ArticleIssue Date2003CitationJOURNAL OF MATERIALS RESEARCH, v.18, no.9, pp.2109 - 2114PublisherMATERIALS RESEARCH SOCIETY
High-strain-rate superplastic flow in 6061 Al composite enhanced by liquid phase

Kim, WJ; Hong, SH; Jeong, HG; Min, SH

ArticleIssue Date2002CitationJOURNAL OF MATERIALS RESEARCH, v.17, no.1, pp.65 - 74PublisherMATERIALS RESEARCH SOC
Effect of mechanical alloying on combustion synthesis of MoSi2

Park, HS; Shin, KS; Kim, YS

ArticleIssue Date2001CitationJOURNAL OF MATERIALS RESEARCH, v.16, no.11, pp.3060 - 3068PublisherCAMBRIDGE UNIV PRESS
Interface structure and solute segregation behavior in SiC/2124 and SiC/6061 Al composites exhibiting high-strain-rate superplasticity

Kim, WJ; Kum, DW; Jeong, HG

ArticleIssue Date2001CitationJOURNAL OF MATERIALS RESEARCH, v.16, no.8, pp.2429 - 2435PublisherCAMBRIDGE UNIV PRESS
Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections

Lee, JH; Park, JH; Lee, YH; Kim, YS; Shin, DH

ArticleIssue Date2001CitationJOURNAL OF MATERIALS RESEARCH, v.16, no.5, pp.1227 - 1230PublisherCAMBRIDGE UNIV PRESS
Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections

Lee, JH; Park, JH; Lee, YH; Kim, YS

ArticleIssue Date2001CitationJOURNAL OF MATERIALS RESEARCH, v.16, no.5, pp.1249 - 1251PublisherCAMBRIDGE UNIV PRESS
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