Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections
- Authors
- Lee, JH; Park, JH; Lee, YH; Kim, YS
- Issue Date
- May-2001
- Publisher
- CAMBRIDGE UNIV PRESS
- Citation
- JOURNAL OF MATERIALS RESEARCH, v.16, no.5, pp.1249 - 1251
- Journal Title
- JOURNAL OF MATERIALS RESEARCH
- Volume
- 16
- Number
- 5
- Start Page
- 1249
- End Page
- 1251
- URI
- https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/27215
- DOI
- 10.1557/JMR.2001.0175
- ISSN
- 0884-2914
- Abstract
- Effects Cu and Ni additions on Au embrittlement of eutectic Sn-Pb solder interconnections during a solid-state aging treatment were evaluated using a ball shear testing method. The addition resulted in a formation of Au-containing ternary intermetallic compounds, either Au-Sn-Cu or Au-Sn-Ni phase, inside the solder matrix during aging treatment. The fracture energy of the solder interconnection containing 2.9 wt% Cu remained almost the same up to 200 h of aging treatment at 150 degreesC, demonstrating the possibility of suppressing the Au embrittlement by forming ternary intermetallic phases inside the solder matrix.
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Collections - College of Engineering > Materials Science and Engineering Major > 1. Journal Articles
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