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Wet Etching시 Ultrasonic의 주파수가 실리콘 웨이퍼 표면형상에 미치는 영향

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dc.contributor.authorRoh, Jae Seung-
dc.date.available2020-04-25T10:26:17Z-
dc.date.created2020-04-01-
dc.date.issued2013-05-23-
dc.identifier.urihttps://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/10056-
dc.publisher한국재료학회-
dc.titleWet Etching시 Ultrasonic의 주파수가 실리콘 웨이퍼 표면형상에 미치는 영향-
dc.typeConference-
dc.contributor.affiliatedAuthorRoh, Jae Seung-
dc.identifier.bibliographicCitation2013년도 한국재료학회 춘계학술발표대회 및 제 24회 신소재 심포지엄, v.2013, no.1, pp.148-
dc.relation.isPartOf2013년도 한국재료학회 춘계학술발표대회 및 제 24회 신소재 심포지엄-
dc.relation.isPartOf2013년도 한국재료학회 춘계학술발표대회 논문집-
dc.citation.title2013년도 한국재료학회 춘계학술발표대회 및 제 24회 신소재 심포지엄-
dc.citation.volume2013-
dc.citation.number1-
dc.citation.startPage148-
dc.citation.endPage148-
dc.citation.conferencePlaceKO-
dc.citation.conferencePlace여수 엠블호텔-
dc.type.rimsCONF-
dc.description.journalClass2-
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