Ag/Sn/Ag 샌드위치 구조를 갖는 Backside Metallization을 이용한 고온 반도체 접합 기술
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 최진석 | - |
dc.contributor.author | 안성진 | - |
dc.date.available | 2021-04-29T08:41:38Z | - |
dc.date.created | 2020-10-05 | - |
dc.date.issued | 2020-01 | - |
dc.identifier.issn | 1226-9360 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/19090 | - |
dc.description.abstract | The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge). | - |
dc.language | 한국어 | - |
dc.language.iso | ko | - |
dc.publisher | 한국마이크로전자및패키징학회 | - |
dc.title | Ag/Sn/Ag 샌드위치 구조를 갖는 Backside Metallization을 이용한 고온 반도체 접합 기술 | - |
dc.title.alternative | High-temperature Semiconductor Bonding using Backside Metallization with Ag/Sn/Ag Sandwich Structure | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | 안성진 | - |
dc.identifier.bibliographicCitation | 마이크로전자 및 패키징학회지, v.27, no.1, pp.1 - 7 | - |
dc.relation.isPartOf | 마이크로전자 및 패키징학회지 | - |
dc.citation.title | 마이크로전자 및 패키징학회지 | - |
dc.citation.volume | 27 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 7 | - |
dc.type.rims | ART | - |
dc.identifier.kciid | ART002576075 | - |
dc.description.journalClass | 2 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | kci | - |
dc.subject.keywordAuthor | backside metallization | - |
dc.subject.keywordAuthor | die attach | - |
dc.subject.keywordAuthor | Ag/Sn/Ag sandwich structure | - |
dc.subject.keywordAuthor | high-temperature semiconductor | - |
dc.subject.keywordAuthor | soldering | - |
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