Heat Dissipation Design and Verification of Military Electronic Equipment Using 3D Printing Duct
- Authors
- Jin, Sung-Eun; Lee, Seung-Cheol; Kim, Sung-Kuk; Lee, Gong-Hee; Yoon, Eui-Yeol; Heo, Jang-Wook
- Issue Date
- Sep-2023
- Publisher
- KOREAN SOC MECHANICAL ENGINEERS
- Keywords
- Military Electronic Equipment; 3D Printing; Finite Element Analysis; Thermal Design; Computational Fluid Dynamics
- Citation
- TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A, v.47, no.9, pp.755 - 761
- Journal Title
- TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A
- Volume
- 47
- Number
- 9
- Start Page
- 755
- End Page
- 761
- URI
- https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/21787
- DOI
- 10.3795/KSME-A.2022.47.9.755
- ISSN
- 1226-4873
- Abstract
- In this study, the heat dissipation structure of the high-heat electronic equipment system was improved using the CFD analysis technique and 3D printing duct. By arranging the power supply in a separate space, the amount of cooling air flowing into the circuit card assembly was increased, and a geometric 3D printing duct was installed to concentrate cooling air into the high-heating circuit card assembly. Subsequently, an improved prototype was manufactured and operation tests were conducted in a high-temperature environment. The results confirmed that the electronic equipment was operated stably at high temperature and that the high-heat circuit card assembly had an average high-temperature margin of 17 degrees C based on the allowable temperature.
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Collections - School of Mechanical System Engineering > 1. Journal Articles
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