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Wireless Dual Mode Haptic Thimble based on Magnetoactive Rubber

Authors
Heo, Yong HeaAn, GyubinKim, Hyun-JeongKim, Sang-YounHashem, Mohammad ShadmanJeon, SeokheeChoi, Dong-Soo
Issue Date
202307
URI
https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/21910
DOI
10.1109/WHC56415.2023.10224377
Conference Name
2023 IEEE WORLD HAPTICS CONFERENCE, WHC
Place
미국
Delft, NETHERLANDS
Conference Name
IEEE World Haptics Conference (WHC)
ISSN
2835-9518
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Department of Computer Engineering > 2. Conference Papers

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Choi, Dong-Soo
College of Engineering (Department of Computer Engineering)
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