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가변 구속상자를 이용한 점-표면배정방법에 의한 표면실장 솔더페이스트의 삼차원 해석 및 검사3-D Analysis and Inspection of Surface Mounted Solder Pastes by Point-to-Surface Assignment Method Using Variable Bounding Box
- Other Titles
- 3-D Analysis and Inspection of Surface Mounted Solder Pastes by Point-to-Surface Assignment Method Using Variable Bounding Box
- Authors
- 신동원
- Issue Date
- 2003
- Publisher
- 한국정밀공학회
- Keywords
- metrology측정학; inspection검사; pointcloud점구름; solderpasters솔더페이스트; histogram히스토그램; gradient기울기; boundingbox구속상자; surfacefitting표면맞춤; solderpastes솔더페이스트; histograni히스토그램
- Citation
- 한국정밀공학회지, v.20, no.3, pp 210 - 220
- Pages
- 11
- Journal Title
- 한국정밀공학회지
- Volume
- 20
- Number
- 3
- Start Page
- 210
- End Page
- 220
- ISSN
- 1225-9071
2287-8769
- Abstract
- This work presents a method of point to surface assignment for 3D metrology of solder pastes on PCB. A bounding box enclosing the solder paste tightly on all sides is introduced to avoid incorrect assignment. The shape of bounding box for solder paste brick is variable according to geometry of measured points. The surface geometry of bounding box is obtained by using five peaks selected in the histogram of normalized gradient vectors. By using the bounding box enclosing the solder pastes, the task of point-to-surface assignment has been successfully conducted, then geometrical features are obtained through the task of surface fitting.
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