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ISDG를 이용한 다결정실리콘의 기계적 물성값 측정법Techniques for Measuring Mechanical Properties of Polysilicon using an ISDG
- Other Titles
- Techniques for Measuring Mechanical Properties of Polysilicon using an ISDG
- Authors
- 오충석; William. N. Sharpe, Jr.
- Issue Date
- 2004
- Publisher
- 한국정밀공학회
- Keywords
- MEMS(미세기계전자시스템); Thin-film (박막); Polysilicon (다결정실리콘); Tensile specimen (인장시험편); ISDG (레이저간섭변형률게이지); Elastic modulus (탄성계수); CTE (열팽창계수); Creep (크리프)
- Citation
- 한국정밀공학회지, v.21, no.7, pp 171 - 178
- Pages
- 8
- Journal Title
- 한국정밀공학회지
- Volume
- 21
- Number
- 7
- Start Page
- 171
- End Page
- 178
- ISSN
- 1225-9071
2287-8769
- Abstract
- Techniques and procedures are presented for measuring mechanical properties on thin-film polysilicon. Narrow platinum lines are deposited 250 m apart on tensile specimens that are 3.5 m thick and 600 m wide. Load is applied by a piezo-actuator and by hanging weights. Strain is measured by an ISDG at temperatures up to 500 oC. Measurements of the elastic modulus with jig modifications, loading speed and temperature change are presented first. And then, the preliminary data for the coefficient of thermal expansion and creep behavior are presented as a reference.
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