Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Si Cathode 개발을 위한 연삭 및 폴리싱 가공특성Processing Characteristics of Grinding & Polishing for Si Cathode Development
- Other Titles
- Processing Characteristics of Grinding & Polishing for Si Cathode Development
- Issue Date
- 2010
- Publisher
- 한국기계가공학회
- Keywords
- Cathode(전극); Silicon(실리콘); Grinding Tool(연삭공구); Wool Wheel(양모 휠); Cathode(전극); Silicon(실리콘); Grinding Tool(연삭공구); Wool Wheel(양모 휠)
- Citation
- 한국기계가공학회지, v.9, no.2, pp 26 - 32
- Pages
- 7
- Journal Title
- 한국기계가공학회지
- Volume
- 9
- Number
- 2
- Start Page
- 26
- End Page
- 32
- ISSN
- 1598-6721
2288-0771
- Abstract
- This paper reports some experimental result in grinding and polishing of silicon cathodes used in semiconductor manufacturing process. Cup shape diamond core wheels were used in experiments and the radial and tangential grinding forces were measured with surface roughness. In polishing experiments, flat type and donut type wool polishing tools were tested. The experimental results indicate that the grinding forces are proportional to the material removal rates and the surface roughness are inversely proportional to the spindle speed. The surface roughness of polished Si decreases with polishing time and higher spindle speed.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - Department of Mechanical Design Engineering > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.