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ITO 증착용 인라인 챔버 온도 분포해석에 의한 캐리어장치의 설계Carrier Design by Temperature Distribution Analysis in Chamber of ITO Deposition Inline Sputter
- Other Titles
- Carrier Design by Temperature Distribution Analysis in Chamber of ITO Deposition Inline Sputter
- Issue Date
- 2015
- Publisher
- 한국기계가공학회
- Keywords
- Temperature Distribution Analysis(온도분포해석); ITO Deposition(산화인듐주석증착); Sputtering(스퍼터링); Chamber(챔버); Carrier(캐리어); Phone Glass(휴대폰 유리)
- Citation
- 한국기계가공학회지, v.14, no.1, pp 92 - 97
- Pages
- 6
- Journal Title
- 한국기계가공학회지
- Volume
- 14
- Number
- 1
- Start Page
- 92
- End Page
- 97
- ISSN
- 1598-6721
2288-0771
- Abstract
- The design of the glass-carrier was studied using simulations of the temperature distribution of an ITO deposition inline-sputter process. The temperature distribution was simulated in Heating Chamber 7, and in the ITO Deposition Chambers 8 and 9. The temperature distribution of the glass sheets was low in both the lower and upper lines. Moreover, it was observed that the temperature in Chamber 8 significantly affected the temperature in Chamber 9, and that the latter was hotter. The rear of the chambers were subjected to more heating than the fronts, so the temperature range at the back was wider. Redesigning the shape of the carrier made it possible to load more glass sheets on the glass carrier, and to make deposits on the ITO glass at higher temperature, over a wider area.
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Collections - School of Mechanical System Engineering > 1. Journal Articles
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