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원형 실린더 주위의 고온 유동에서 입자의 부착 해석Simulation of the Particle Deposition on a Circular Cylinder in High-Temperature Particle-Laden Flow

Other Titles
Simulation of the Particle Deposition on a Circular Cylinder in High-Temperature Particle-Laden Flow
Authors
정석민김동주
Issue Date
2019
Publisher
한국기계가공학회
Keywords
Circular Cylinder(원형실린더); Thermophoresis(열영동); Particle Deposition(입자 부착); Particle Interception(입자 인터셉션)
Citation
한국기계가공학회지, v.18, no.2, pp 73 - 81
Pages
9
Journal Title
한국기계가공학회지
Volume
18
Number
2
Start Page
73
End Page
81
URI
https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/23621
DOI
10.14775/ksmpe.2019.18.2.073
ISSN
1598-6721
2288-0771
Abstract
Numerical simulations are performed for the thermal fluid flow around a circular cylinder, and the particle trajectories are calculated to investigate the particle motions and deposition characteristics. We aim to understand the effects of three important parameters (particle Stokes number, temperature difference in the flow and on the cylinder surface, and thermal conductivity ratio between the fluid and the particles) on the deposition efficiency. The results show that the thermophorectic effect is insignificant for particles with large Stokes numbers, but it affects particles with small Stokes numbers. The deposition efficiency increases with the increase in temperature difference between the flow and the cylinder or the decrease in ratio of thermal conductivity of the particles to the fluid. When thermophoresis becomes significant, the particles are deposited even on the back side of the cylinder.
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