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반도체 BGA(Ball Grid Array) 패키지의 Solder Ball검사를 위한 영상처리 알고리즘에 관한 연구A study on image processing algorithm for solder ball inspection of BGA(Ball Grid Array) Package
- Other Titles
- A study on image processing algorithm for solder ball inspection of BGA(Ball Grid Array) Package
- Authors
- 오영석
- Issue Date
- Sep-2000
- Publisher
- 금오공대 산업기술개발연구원
- Citation
- 산업기술개발연구, v.16, no.3, pp 263 - 286
- Pages
- 24
- Journal Title
- 산업기술개발연구
- Volume
- 16
- Number
- 3
- Start Page
- 263
- End Page
- 286
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Collections - School of Electronic Engineering > 1. Journal Articles
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