Numerical investigation of heat transfer in aluminum nitride ceramics with engineered microstructures

Abstract

We present a comprehensive investigation into the thermal conduction behavior of aluminum nitride (AlN) ceramics with engineered microstructures. A finite element method is employed to investigate the impact of grain boundaries, secondary phases, pores, and inclusion of reinforcement additives on the thermal conductivity of polycrystalline AlN ceramics. Our numerical approach is built upon experimental observations that provide geometric and materials-based understanding for numerical modeling. Our model accurately predicts the thermal conductivity of hot-pressed AlN ceramics, which underwent systematic microstructure engineering through fine-tuning sintering parameters. This numerical approach provides valuable insights into microstructure engineering and a broader understanding of heat transfer in AlN ceramics.