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Effect of Adhesion Promoters on Curing Kinetics and Adhesion to Epoxy in a Norbornene-Based Resin System
- Authors
- Choi, Jung Hwa; Cho, Donghwan; Lee, Jong Keun
- Issue Date
- Sep-2018
- Publisher
- POLYMER SOC KOREA
- Keywords
- endo-dicyclopentadiene; adhesion promoter; cure kinetics; epoxy; bonding strength
- Citation
- POLYMER-KOREA, v.42, no.5, pp 822 - 833
- Pages
- 12
- Journal Title
- POLYMER-KOREA
- Volume
- 42
- Number
- 5
- Start Page
- 822
- End Page
- 833
- ISSN
- 0379-153X
2234-8077
- Abstract
- The cure kinetics of endo-dicyclopentadiene (endo-DCPD) and the bonding strength to epoxy were investigated in this study. To increase the bonding strength, norbomene carboxylic acid (NCA) and norbomene methanol (NM) were used as adhesion promoters. The endo-DCPD monomer containing various contents of NCA or NM adhesion promoters was reacted with the 1st generation and the 2nd generation Grubbs catalysts via a ring-opening metathesis polymerization (ROMP), and the dynamic cure behavior was measured using differential scanning calorimetry (DSC). The effects of Grubbs catalysts and adhesion promoters on the curing kinetics of endo-DCPD were characterized using the dynamic DSC analysis and the model-free isoconversion method. From the result of the adhesion test for epoxy resins with endo-DCPD, the bonding strength was increased by the adhesion promoters, which is ascribed to the hydrogen bond formation between the epoxy resin and the adhesion promoters.
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