Octylphenol ethoxylate surfactant as a suppressor in copper electrodeposition
- Authors
- Kang, Jinseok; Kim, Chan Mi; Yu, Da Yeong; Ham, Yu Seok; Cho, Sung Ki; Kim, Jae Jeong
- Issue Date
- 2-Jan-2019
- Publisher
- TAYLOR & FRANCIS LTD
- Keywords
- Cu electrodeposition; surfactant; additive; Triton X-100; PEG; suppressor; inhibition; filling
- Citation
- TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, v.97, no.1, pp 22 - 27
- Pages
- 6
- Journal Title
- TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
- Volume
- 97
- Number
- 1
- Start Page
- 22
- End Page
- 27
- URI
- https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/28216
- DOI
- 10.1080/00202967.2019.1551276
- ISSN
- 0020-2967
1745-9192
- Abstract
- In this study, the role of octylphenol ethoxylate (Triton X-100) surfactant as a suppressor in Cu electrodeposition has been examined. The inhibition ability of Triton X-100 was qualitatively and quantitatively evaluated with cyclic voltammograms and KouteckA-Levich plots, and compared with that of polyethylene glycol (PEG) with similar molecular size. The presence of a hydrophobic benzene-ring in its structure made it inhibit Cu deposition more strongly than PEG. The inhibition function of Triton X-100 depended on the substrate material and it was influenced by the presence of Cl- and bis sulphopropyl disulphide in the electrolyte indicating that the characteristics of Triton X-100 were similar to those of PEG, which was also demonstrated by gap filling of Cu with using Triton X-100 in the replacement of PEG. The effect of Triton X-100 on the properties of the deposit film was also investigated, and it was found that it suppressed the three-dimensional growth of Cu.
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