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Performance of Recessed Anode AlGaN/GaN Schottky Barrier Diode Passivated With High-Temperature Atomic Layer-Deposited Al2O3 Layer

Authors
Lee, Jae-HoonIm, Ki-SikKim, Jong KyuLee, Jung-Hee
Issue Date
Jan-2019
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
AlGaN/GaN; high-temperature atomic layer deposition (ALD); leakage current; Schottky barrier; turn-on voltage
Citation
IEEE TRANSACTIONS ON ELECTRON DEVICES, v.66, no.1, pp 324 - 329
Pages
6
Journal Title
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume
66
Number
1
Start Page
324
End Page
329
URI
https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/28218
DOI
10.1109/TED.2018.2875356
ISSN
0018-9383
1557-9646
Abstract
We have proposed a method of surface passivation with high-temperature atomic layer-deposited (ALD) Al2O3 layer on the fully recessed anode AlGaN/GaN-based Schottky-barrier diode (SBD) and systematically analyzed the cause of the lateral and the vertical leakage component in the SBD. The forward turn-on voltage of the recessed SBD decreased to 0.38 V from the value of 0.8 V of the nonrecessed SBD due to the lowered barrier height. Application of the ALD Al2O3 surface passivation layer to the recessed SBD, which was deposited at higher temperature (550 degrees C), significantly improved the performances of the proposed SBD such as high on-current of 12 A at 1.5 V and increased breakdown voltage of 780 V with greatly decreased reverse leakage current (at least 3 orders lower inmagnitude), compared to the correspondingon-current of 6 A at 1.5 V and breakdown voltage of 510 V of the reference SBD.
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