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Effect of In-Situ Silicon Carbon Nitride (SiCN) Cap Layer on Performances of AlGaN/GaN MISHFETs

Authors
Lee, Jae-HoonIm, Ki-SikLee, Jung-Hee
Issue Date
2021
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
AlGaN/GaN; metal insulator semiconductor heterostructure field effect transistors (MISHFETs); in-situ silicon carbon nitride (SiCN); cap layer; 2DEG density; surface leakage current
Citation
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, v.9, pp 728 - 734
Pages
7
Journal Title
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
Volume
9
Start Page
728
End Page
734
URI
https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/28309
DOI
10.1109/JEDS.2021.3100760
ISSN
2168-6734
Abstract
AlGaN/GaN metal insulator semiconductor heterostructure field effect transistors (MISHFETs) with different thickness of in-situ silicon carbon nitride (SiCN) cap layer were investigated. It was found that in-situ SiCN layer not only increases the two dimensional electron gas (2DEG) density, but also effectively passivates the surface of the AlGaN/GaN MISHFET. The fabricated device with 2 nm-thick SiCN cap layer exhibits superior device performances, such as larger maximum transconductance (g(m)) and higher on/off drain-current ratio (I-ON/I-OFF) compared to those of the device without SiCN cap layer.
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