구리전해도금에서 알킬아민의 영향 연구Study on the Effect of Alkylamines on Cu Electroplating
- Other Titles
- Study on the Effect of Alkylamines on Cu Electroplating
- Authors
- Lee, Jaewon; Shin, Yeong Min; Bang, Daesuk; Cho, Sung Ki
- Issue Date
- May-2022
- Publisher
- KOREAN ELECTROCHEMICAL SOC
- Keywords
- Cu Electroplating; Additive; Alkylamine; Alkyldiamine; Inhibitor
- Citation
- JOURNAL OF THE KOREAN ELECTROCHEMICAL SOCIETY, v.25, no.2, pp 81 - 87
- Pages
- 7
- Journal Title
- JOURNAL OF THE KOREAN ELECTROCHEMICAL SOCIETY
- Volume
- 25
- Number
- 2
- Start Page
- 81
- End Page
- 87
- URI
- https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/28394
- DOI
- 10.5229/JKES.2022.25.2.81
- ISSN
- 1229-1935
2288-9000
- Abstract
- In this study, the effect of alkylamine on copper electroplating was analyzed using cyclic voltammetry. When water-soluble alkylamines were added to the plating solution, the reduction reaction of Cu2+ was inhibited. The inhibition effect of 1,12-diaminododecane has been investigated at various concentrations and conditions of the plating solution. 1,12-diaminododecane was protonated in the acidic plating solution, and therefore, it did not act as a complexing agent for Cu2+. Accordingly, it was confirmed that the inhibiton effect of 1,12-diaminododecane was attributed to adsorption on the Cu surface. The adsorption of 1,12-diaminododecane exhibits two characteristics: (i) protonation and subsequent electrostatic attraction with anions pre-adsorbed on Cu surface, and (ii) direct adsorption on Cu surface via amine functional group. The adsorbed 1,12-diaminododecane caused three-dimensional growth and grain refining, as well as the inhibition effect, during Cu electroplating.
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