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Effect of Polyethylene Glycol on Cu Electrodeposition구리전해도금에서 폴리에틸렌글리콜(polyethylene glycol)의 영향 연구
- Other Titles
- 구리전해도금에서 폴리에틸렌글리콜(polyethylene glycol)의 영향 연구
- Authors
- An, Eui Gyeong; Choi, Sun Gi; Lee, Jaewon; Cho, Sung Ki
- Issue Date
- Aug-2022
- Publisher
- KOREAN ELECTROCHEMICAL SOC
- Keywords
- Cu Electrodeposition; Additive; Polyethylene Glycol; Suppressor
- Citation
- JOURNAL OF THE KOREAN ELECTROCHEMICAL SOCIETY, v.25, no.3, pp 113 - 118
- Pages
- 6
- Journal Title
- JOURNAL OF THE KOREAN ELECTROCHEMICAL SOCIETY
- Volume
- 25
- Number
- 3
- Start Page
- 113
- End Page
- 118
- ISSN
- 1229-1935
2288-9000
- Abstract
- In this study, the effect of polyethylene glycol (PEG) on Cu electrodeposition was analyzed using cyclic voltammetry. The adsorption of PEG was affected by the specific adsorption of sulfate ion (SO42-) or chloride ion (Cl-). In SO42--based plating solution, the adsorption of PEG was limited by the adsorbed SO42-. Accordingly, the adsorbed PEG could suppress the electron transfer for Cu electrodeposition, but its effect was not significant. Meanwhile, in the plating solution composed of perchlorate ion (ClO4-) which does not specifically adsorb on Cu surface, a strong suppression effect of PEG was observed and it was proportional to the molecular weight of PEG. On the other hand, when Cl- was specifically adsorbed on Cu surface, the suppression effect of PEG was enhanced because PEG and Cl- formed an interrelated adsorbate. The synergetic effect of PEG and Cl- depended on the composition of the plating solution,
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