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High Entropy Alloy 분말의 3D 프린팅 SLM공정에서의 Packing Density에 대한 이산요소법 해석

Authors
Park Junyoung
Issue Date
19-Apr-2019
Publisher
한국기계가공학회
Citation
한국기계가공학회 춘계학술대회, v.1, no.1, pp.127-127
URI
https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/2940
Conference Name
한국기계가공학회 춘계학술대회
Place
KO
진주 동방호텔
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College of Engineering (School of Mechanical System Engineering)
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