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실리콘웨이퍼의 습식식각 시 표면거칠기에 따른 전기비저항 변화
- Authors
- Roh, Jae Seung
- Issue Date
- 28-Nov-2014
- Publisher
- 한국재료학회
- Citation
- 2014년 한국재료학회 추계학술대회, v.1, no.1, pp.184
- Conference Name
- 2014년 한국재료학회 추계학술대회
- Place
- KO
대전컨벤션센터
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Collections - Department of Materials Science and Engineering > 2. Conference Papers
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Related Researcher
- Roh, Jae Seung
- College of Engineering (Department of Materials Science and Engineering)