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Optimization of partially crowned roller profiles for tapered roller bearings

Tong, Van-Canh; Hong, Seong-Wook

ArticleIssue Date2017CitationJOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.31, no.2, pp 641 - 650PublisherKOREAN SOC MECHANICAL ENGINEERS

AMI Data-Driven Strategy for Hierarchical Estimation of Distribution Line Impedances Go to Link

Ban, Jaepil; Park, Jae-Young; Kim, Young-Jin; Catalao, Joao P. S.

ArticleIssue Date2023CitationIEEE TRANSACTIONS ON POWER DELIVERY, v.38, no.1, pp 513 - 527PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

Ultra-precision 3 DOF tilting stage for workpiece setup of scalable micro-pattern machining

Kim, Jong-Su; Youn, Hongseok; Kang, Bongchul

ArticleIssue Date2017CitationINTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, v.18, no.8, pp 1103 - 1109PublisherKOREAN SOC PRECISION ENG

Preparation of an Injectable Alginate Hydrogel by Enzymatic Crosslinking Reaction and Application to Wound Healing Agents

Lee, Seung Wook; Ko, Yunjeh; Chung, Ho Yun; Kwon, Oh Hyeong

ArticleIssue Date2023CitationPOLYMER-KOREA, v.47, no.4, pp 469 - 478PublisherPOLYMER SOC KOREA

Inspection of intermodular connection locations for multistory modular buildings open access

Moon, Jae Sang; Seo, Wonseok; Ahn, Hyeunguk; Kim, Jinyoung

ArticleIssue Date2024CitationMEASUREMENT & CONTROLPublisherSAGE PUBLICATIONS LTD

Modeling nutrient removal by membrane bioreactor at a sewage treatment plant using machine learning models Go to Link

Yaqub, Muhammad; Lee, Wontae

ArticleIssue Date2022CitationJOURNAL OF WATER PROCESS ENGINEERING, v.46PublisherELSEVIER

Unraveling the Mechanical Property Decrease of Electrospun Spider Silk: A Molecular Dynamics Simulation Study

Shin, Hongchul; Yoon, Taeyoung; Park, Wooboum; You, Juneseok; Na, Sungsoo

ArticleIssue Date2024CitationACS APPLIED BIO MATERIALS, v.7, no.3, pp 1968 - 1975PublisherAMER CHEMICAL SOC

A D-Band Low-Power and High-Efficiency Frequency Multiply-by-9 FMCW Radar Transmitter in 28-nm CMOS Go to Link

Park, Sehoon; Park, Dae-Woong; Vaesen, Kristof; Kankuppe, Anirudh; Sinha, Siddhartha; van Liempd, Barend; Wambacq, Piet; Craninckx, Jan

ArticleIssue Date2022CitationIEEE JOURNAL OF SOLID-STATE CIRCUITS, v.57, no.7, pp 2114 - 2129PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

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