나노임프린트 공정에서의 냉각성능 개선에 대한 수치해석Numerical Analysis for Improvement of Cooling Performance in Nanoimprint Lithography Process
- Other Titles
- Numerical Analysis for Improvement of Cooling Performance in Nanoimprint Lithography Process
- Authors
- 이기연; 전상범; 김국원
- Issue Date
- 2011
- Publisher
- 한국반도체디스플레이기술학회
- Keywords
- Nanoimprint lithography; Heat Flow; Flow Simulation; Cooling System
- Citation
- 반도체디스플레이기술학회지, v.10, no.4, pp.89 - 94
- Journal Title
- 반도체디스플레이기술학회지
- Volume
- 10
- Number
- 4
- Start Page
- 89
- End Page
- 94
- URI
- https://scholarworks.bwise.kr/sch/handle/2021.sw.sch/16963
- ISSN
- 1738-2270
- Abstract
- In recent years there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. A major disadvantage of thermal NIL is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to improve the cooling performance in NIL process. In this paper, a numerical analysis model of cooling system in thermal NIL was development by CAD/CAE program and the performance of the cooling system was analyzed by the model. The calculated temperatures of nanoimprint device were verified by the measurements. By using the analysis model, the case that the cooling material is replaced by liquid nitrogen is investigated.
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Collections - College of Engineering > Department of Mechanical Engineering > 1. Journal Articles
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