D-Band <inline-formula> <tex-math notation=LaTeX>$\times$</tex-math> </inline-formula>8 Frequency Multiplier Using Complementary Differential Frequency Doubler
- Authors
- Park, J.[Park, J.]; Yang, D.[Yang, D.]; Choi, K.[Choi, K.]; Kim, B.[Kim, B.]
- Issue Date
- Mar-2023
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Keywords
- CMOS; D-band; Frequency measurement; frequency multiplier; Harmonic analysis; harmonic rejection (HR); millimeter wave; Mixers; MOS devices; Power generation; Transformers; Wireless communication
- Citation
- IEEE Microwave and Wireless Components Letters, v.33, no.3, pp.1 - 4
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE Microwave and Wireless Components Letters
- Volume
- 33
- Number
- 3
- Start Page
- 1
- End Page
- 4
- URI
- https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/101197
- DOI
- 10.1109/LMWC.2022.3216019
- ISSN
- 1531-1309
- Abstract
- A D-band <inline-formula> <tex-math notation=LaTeX>$\times$</tex-math> </inline-formula>8 frequency multiplier is presented in this letter. The <inline-formula> <tex-math notation=LaTeX>$\times$</tex-math> </inline-formula>8 frequency multiplier consists of two stages of the newly proposed common load complementary push-push doublers (CL-CPPDs) and one stage of NMOS push-push doubler. The proposed CL-CPPD uses a single load to generate a balanced output with high harmonic rejection (HR) and can be easily cascaded using transformers for a high multiplication ratio with low dc power consumption. The chip is fabricated by using a 40-nm CMOS technology, and it achieves a maximum output power of <inline-formula> <tex-math notation=LaTeX>$-$</tex-math> </inline-formula>2.48 dBm with an input power of <inline-formula> <tex-math notation=LaTeX>$0$</tex-math> </inline-formula> dBm in the frequency range of 131.2–144.8 GHz. All HRs are over 34 dBc in the frequency range of 131.2–144.8 GHz. The total dc power dissipation is 41.4 mW when supplied from a single voltage of 0.9 V and occupies 0.37 <inline-formula> <tex-math notation=LaTeX>${\mathrm{mm}}^{2}$</tex-math> </inline-formula> of the chip area. IEEE
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Collections - Information and Communication Engineering > Department of Semiconductor Systems Engineering > 1. Journal Articles
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