Electrical transport behaviors of Ni layer on carbon fiber
- Authors
- Kang, S.S.[Kang, S.S.]; Kim, J.Y.[Kim, J.Y.]; Choi, W.[Choi, W.]; Ahn, B.[Ahn, B.]; Oh, S.[Oh, S.]; Kim, G.[Kim, G.]; Sim, E.[Sim, E.]; Kim, Y.-M.[Kim, Y.-M.]; Kim, W.S.[Kim, W.S.]; Choi, Y.C.[Choi, Y.C.]; Lim, S.C.[Lim, S.C.]
- Issue Date
- Mar-2023
- Publisher
- Elsevier B.V.
- Keywords
- Carbon fiber; Grain size; Ni coating; P concentration; Temperature coefficient of resistance (TCR)
- Citation
- Physica E: Low-Dimensional Systems and Nanostructures, v.147
- Indexed
- SCIE
SCOPUS
- Journal Title
- Physica E: Low-Dimensional Systems and Nanostructures
- Volume
- 147
- URI
- https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/104708
- DOI
- 10.1016/j.physe.2022.115567
- ISSN
- 1386-9477
- Abstract
- Recently, carbon materials have been employed for the core of metal wires, contributing to their weight reduction. Low weight is a required characteristic for cables used in air, water, and ground transportations, in order to maximize fuel efficiency. Nowadays, the hybridization of C with metal for the creation of C-based metal wires is achieved through different approaches. A thin metal layer of Ni is usually applied through electroless plating on the surface of C fibers (CFs; diameter = 7 μm). Transport studies conducted on a single strand of Ni-coated CFs (Ni-CF) have indicated that, depending on the grain size, phonon-supported hopping or phonon-driven electron scattering transport can dominate. At a given P concentration (∼11 at.wt.%) and when the average grain size is < 100 nm, phonon-driven electron scattering transport dominates: as the temperature increases, the resistance increases as well, resulting in a positive temperature coefficient of resistance (TCR) (∼1.5 × 10−3/K at 300 K). This is a conduction behavior typically observed in metals. However, when the average grain size is > 100 nm, impurity-related variable range hopping (VRH) transport dominated, leading to a negative TCR (∼1.0 × 10−4/K at 300 K); in this case, the resistance decreases with increasing temperature, as in a semiconductor. Our results imply that, by controlling the plating condition and surface morphology of CF, it is possible to modulate metal properties (i.e., the metal-insulator transition (MIT)). © 2022
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