Design and Verification Methodologies of D-Band Antenna Modules for Security Imaging Applications

Abstract

This research presents the design and verification methodologies of cavity-backed slot antenna (CBSA) modules for D-band security imaging applications. First, to realize low-loss feeding networks in the D-band spectrum, the microstrip transmission line (TL) and 3-D interconnection structures based on the multi-layer low-temperature co-fired ceramic (LTCC) process have been designed and characterized. Moreover, to achieve low-loss interconnection in local-oscillation (LO) & intermediate-frequency (IF) parts of transmitting (TX)/receiving (RX) modules, the transition structures between FR-4 PCB and LTCC have been realized by utilizing a flip-chip bonding process. Second, the CBSA with low-loss 3-D interconnection structures has been proposed for coupling mitigation between the indium phosphide (InP) chipset and antenna. Finally, the antenna modules have been integrated with InP TX/RX chipsets using bonding wires. The measured EIRP of the TX module and conversion gain of the RX module exhibit 3.3∼6.6dBm and 15.0∼ 25.5dB at 117∼145GHz, respectively. © 2023 IEEE.